Apply to 5G Wireless Infrastructure, High-Speed Data Exchange and Storage Industrial Control, AI intelligence, Cloud computing 4K Video Transmission Processing, and Aerospace
Core board-ACU15EG
FPGA Chip-XCZU15EG-2FFVB1156I
Chip CPU-4x ARM Cortex-A53, 1.333GHz; Dual Core Cortex™-R5, 533MHz
Chip GPU-Mali™-400 MP2
RAM-PS DDR4 4GB, 64bit, 2400Mbps/PL DDR4 2GB, 32bit, 2400Mbps
PS-end High Speed Connection-PCIe Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort, 4x Tri-mode Gigabit Ether net
PS-end General Connection-2x USB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO
PL-end GTH-12.5Gb/s x 16
Chip Level-Industrial Grade
Working Temperature- -40°c~85°c
Speed Grades- -2
Logic Cells-747K
CLB Flip-Flops-682K
Look Up Tables (LUTs)-341K
Global Clock-4
DSP Slices-3,528
MAX.DISTRIBU-TED RAM-11.3Mb
BLOCK RAM-26.2Mb
ULTRARAM-31.5Mb
EMMC FLASH-8GB
QSPI FLASH-64MB
HP I/O-96
HD I/O-66
QSPI Flash-2 Pieces of 256 Mbit QSPI Flash, Used as FPGA User Data Storage
EMMC Flash-8GB, Used as Large-Capacity Storage System
40-120 Pin Expansion Ports-Panasonic Industrial Grade High-Speed Inter-Board Connectors
Crystal Oscillator-33.333MHz Provide for the PS system/200MHz Provide DDR Reference Clock for the PL Logic
Voltage Input-Board to Board Connector, + 12V DC
FPGA SoM Board-1
Size Dimension-3.15 inch x 2.36 inch
Number of Layers-16-Layer Core Board PCB
Connector Height-0.12 Inch
Apply to 5G Wireless Infrastructure, High-Speed Data Exchange and Storage Industrial Control, AI intelligence, Cloud computing 4K Video Transmission Processing, and Aerospace
Core board-ACU15EG
FPGA Chip-XCZU15EG-2FFVB1156I
Chip CPU-4x ARM Cortex-A53, 1.333GHz; Dual Core Cortex™-R5, 533MHz
Chip GPU-Mali™-400 MP2
RAM-PS DDR4 4GB, 64bit, 2400Mbps/PL DDR4 2GB, 32bit, 2400Mbps
PS-end High Speed Connection-PCIe Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort, 4x Tri-mode Gigabit Ether net
PS-end General Connection-2x USB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO
PL-end GTH-12.5Gb/s x 16
Chip Level-Industrial Grade
Working Temperature- -40°c~85°c
Speed Grades- -2
Logic Cells-747K
CLB Flip-Flops-682K
Look Up Tables (LUTs)-341K
Global Clock-4
DSP Slices-3,528
MAX.DISTRIBU-TED RAM-11.3Mb
BLOCK RAM-26.2Mb
ULTRARAM-31.5Mb
EMMC FLASH-8GB
QSPI FLASH-64MB
HP I/O-96
HD I/O-66
QSPI Flash-2 Pieces of 256 Mbit QSPI Flash, Used as FPGA User Data Storage
EMMC Flash-8GB, Used as Large-Capacity Storage System
40-120 Pin Expansion Ports-Panasonic Industrial Grade High-Speed Inter-Board Connectors
Crystal Oscillator-33.333MHz Provide for the PS system/200MHz Provide DDR Reference Clock for the PL Logic
Voltage Input-Board to Board Connector, + 12V DC
FPGA SoM Board-1
Size Dimension-3.15 inch x 2.36 inch
Number of Layers-16-Layer Core Board PCB
Connector Height-0.12 Inch
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Tenet Technetronics focuses on “Simplifying Technology for Life” and has been striving to deliver the same from the day of its inception since 2007. Founded by young set of graduates with guidance from ardent professionals and academicians the company focuses on delivering high quality products to its customers at the right cost considering the support and lifelong engagement with customers. “We don’t believe in a sell and forget model “and concentrate and building relationships with customers that accelerates, enhances as well as provides excellence in their next exciting project.