Xilinx Zynq UltraScale+ MPSoC SOM AI FPGA Core Board XCZU15EG XCZU15EG
- Lead time is 3-4 weeks
Description of product
Quad-core ARM Cortex-A53 and Dual-core Cortex-R5 Real-time Processors
Apply to 5G Wireless Infrastructure, High-Speed Data Exchange and Storage Industrial Control, AI intelligence, Cloud computing 4K Video Transmission Processing, and Aerospace
Main Parameters
Core board-ACU15EG
FPGA Chip-XCZU15EG-2FFVB1156I
Chip CPU-4x ARM Cortex-A53, 1.333GHz; Dual Core Cortex™-R5, 533MHz
Chip GPU-Mali™-400 MP2
RAM-PS DDR4 4GB, 64bit, 2400Mbps/PL DDR4 2GB, 32bit, 2400Mbps
PS-end High Speed Connection-PCIe Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort, 4x Tri-mode Gigabit Ether net
PS-end General Connection-2x USB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO
PL-end GTH-12.5Gb/s x 16
Chip Level-Industrial Grade
Working Temperature- -40°c~85°c
Speed Grades- -2
Logic Cells-747K
CLB Flip-Flops-682K
Look Up Tables (LUTs)-341K
Global Clock-4
DSP Slices-3,528
MAX.DISTRIBU-TED RAM-11.3Mb
BLOCK RAM-26.2Mb
ULTRARAM-31.5Mb
EMMC FLASH-8GB
QSPI FLASH-64MB
HP I/O-96
HD I/O-66
Interface and Function
QSPI Flash-2 Pieces of 256 Mbit QSPI Flash, Used as FPGA User Data Storage
EMMC Flash-8GB, Used as Large-Capacity Storage System
40-120 Pin Expansion Ports-Panasonic Industrial Grade High-Speed Inter-Board Connectors
Ｃrystal Oscillator-33.333MHz Provide for the PS system/200MHz Provide DDR Reference Clock for the PL Logic
Power Supply Parameters
Voltage Input-Board to Board Connector, + 12V DC
Package List
FPGA SoM Board-1
Structure Size
Size Dimension-3.15 inch x 2.36 inch
Number of Layers-16-Layer Core Board PCB
Connector Height-0.12 Inch
